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Alan H Saikin

from Jackson, NJ
Age ~69
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Also known as:
Catherine A Saikin, Cathy Alan Saikin, Alen H Saikin
Phone and address:
19 Long Bay Rd, Jackson Twp, NJ 08527
Related to:
Mary J Saikin, 52Timothy Lynch, 63Mark Lange, 62Timothy P Lynch, 39Linda K Lynch, 72Leona Lange
Connected to:
Patricia A Saikin, 66Charles R Saikley, 64Jerry E Saikley, 61Frank Saiko, 64James J Saiko, 61Spencer S Sailakham, 42Carlos M Sailas, 49Irwin Sailas, 42Michelle R Saile, 35Razvan Saileanu, 73

Alan Saikin Phones & Addresses

  • 19 Long Bay Rd, Jackson, NJ 08527
  • Miramar Beach, FL
  • 5 Benjamin Run, Landenberg, PA 19350 (610) 255-5934
  • Binghamton, NY
  • Ocean, NJ
  • Ridge, NY
  • Chester, PA
  • 5 Benjamin Run, Landenberg, PA 19350 (610) 704-9854

Work

Position: Professional/Technical

Education

Degree: High school graduate or higher

Publications

Us Patents

Method Of Forming A Layered Polishing Pad

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US Patent:
7132033, Nov 7, 2006
Filed:
Feb 27, 2004
Appl. No.:
10/788951
Inventors:
Mark J. Boldizar - Lancaster PA, US
Robert T. Gamble - Boothwyn PA, US
Vincent Matthew Hedrick - Weston FL, US
Jason M. Lawhorn - Newark DE, US
Alan H. Saikin - Landenberg PA, US
Katherine L. Tome - Port Deposit MD, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B32B 37/02
US Classification:
156324, 156253, 156269
Abstract:
A method of forming a layered polishing pad is disclosed. The method includes double-laminating a subpad on opposing sides with respective adhesive layers and bonding a polishing pad top layer to the subpad via the upper adhesive layer. The polishing pad optionally includes a window. Because the subpad is double-laminated, an opening can be formed through both the top and bottom adhesive layers as well as the subpad. Thus, when bonded to a top polishing pad layer having a window, the result is a layered polishing pad with a through optical path that does not include an adhesive layer.

Polishing Pad Having A Window With Reduced Surface Roughness

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US Patent:
7169017, Jan 30, 2007
Filed:
Jul 25, 2006
Appl. No.:
11/492443
Inventors:
Alan H. Saikin - Landenberg PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B24B 49/00
B24B 1/00
B24D 11/00
US Classification:
451 6, 451 56, 451528
Abstract:
The present invention provides a polishing pad for performing chemical mechanical planarization of semiconductor substrates. The polishing pad comprises a polishing pad body having an aperture formed therein and a window fixed in the aperture for performing in-situ optical measurements of the substrate. The window has a lower surface capable of transmitting light incident thereon. The lower surface has been treated by laser ablation to remove surface roughness present on the lower surface.

Transparent Polishing Pad

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US Patent:
7273407, Sep 25, 2007
Filed:
Jul 27, 2006
Appl. No.:
11/494434
Inventors:
Alan H. Saikin - Landenberg PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B24B 5/00
US Classification:
451 6, 451285, 451288
Abstract:
The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a separate aperture or window in the polishing pad.

Apparatus For Forming A Polishing Pad Having A Reduced Striations

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US Patent:
7275856, Oct 2, 2007
Filed:
Sep 30, 2004
Appl. No.:
10/956844
Inventors:
Joseph P. Koetas - Landenberg PA, US
Alan E. Leviton - Newburyport MA, US
Samuel J. November - Newtown PA, US
Malcolm W. Robertson - Aston PA, US
Alan H. Saikin - Landenberg PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B01F 13/02
US Classification:
366102, 366137
Abstract:
The present invention provides an apparatus for forming a striation-reduced chemical mechanical polishing pad. The polishing pad comprises a first delivery line for delivering a polymeric material into a mixer and a second delivery line for delivering microspheres into the mixer with the polymeric material. The second delivery line is connected to a bulk density control unit. The bulk density control unit comprises a storage hopper for storing the microspheres. The storage hopper further comprises a porous membrane provided over a plenum. A fluidizing gas source is connected to the plenum through a gas inlet line. Gas fed into the plenum from the fluidizing gas source permeates through the porous membrane and reduces the initial bulk density of the microspheres in the storage hopper.

Apparatus For Forming A Striation Reduced Chemical Mechanical Polishing Pad

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US Patent:
7275928, Oct 2, 2007
Filed:
Nov 23, 2004
Appl. No.:
10/996199
Inventors:
David M. Kolesar - Gulph Mills PA, US
Robert L. Post - Ivyland PA, US
Alan H. Saikin - Landenberg PA, US
Aaron Sarafinas - Ivyland PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B29C 44/06
B01F 13/02
US Classification:
425447, 366137, 366139
Abstract:
The present invention provides an apparatus for forming a chemical mechanical polishing pad, comprising a tank with polymeric materials, a storage silo with microspheres and a curative storage tank with curing agents. The apparatus further provides a premix prep tank for forming a pre-mixture of the polymeric materials and the microspheres and a recirculation loop in the premix prep tank for recirculating the pre-mixture until a desired bulk density is reached. The apparatus further provides a premix run tank for storing the pre-mixture, a mixer for forming a mixture of the pre-mixture and the curing agents and a mold for molding the mixture.

Method Of Forming A Polishing Pad Having Reduced Striations

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US Patent:
7396497, Jul 8, 2008
Filed:
Sep 30, 2004
Appl. No.:
10/956847
Inventors:
Joseph P. Koetas - Landenberg PA, US
Alan E. Leviton - Newburyport MA, US
Samuel J. November - Newtown PA, US
Malcolm W. Robertson - Aston PA, US
Alan H. Saikin - Landenberg PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B28B 11/18
US Classification:
264162, 264161, 264109, 264118, 264 51, 451526, 451 41, 451 59
Abstract:
The present invention provides a method of forming a chemical mechanical polishing pad, comprising providing a tank with polymeric materials and providing a storage hopper with microspheres having an initial bulk density, wherein the storage hopper further comprises a porous membrane provided over a plenum. The method further provides the steps of connecting a fluidizing gas source to the plenum through a gas inlet line and fluidizing the microspheres and reducing the initial bulk density by feeding gas into the plenum. In addition, the method further provides the steps of providing a delivery system for delivering the polymeric materials and the microspheres to a mixer, forming a mixture of the polymeric materials and the microspheres, pouring the mixture into a mold to form a molded product and cutting the molded product into the polishing pad.

Method Of Forming A Chemical Mechanical Polishing Pad Utilizing Laser Sintering

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US Patent:
7517488, Apr 14, 2009
Filed:
Mar 8, 2006
Appl. No.:
11/372322
Inventors:
Alan H. Saikin - Landenberg PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B29C 35/08
US Classification:
264497, 264460, 264482, 264113, 264413
Abstract:
The present invention provides a method of manufacturing a porous chemical mechanical polishing pad comprising focusing a laser beam from a laser into a sintering nozzle and injecting the fluidized thermoplastic particles into the sintering nozzle via an injection port. The method further provides sintering the thermoplastic particles with the laser beam and selectively depositing the sintered thermoplastic particles onto a table to form the polishing pad.

Polishing Pad And Method Of Manufacture

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US Patent:
8357027, Jan 22, 2013
Filed:
Jul 27, 2006
Appl. No.:
11/494050
Inventors:
Alan H. Saikin - Landenberg PA, US
Assignee:
Rohm and Haas Electronic Materials CMP Holdings, Inc. - Newark DE
International Classification:
B24B 7/22
US Classification:
451 56, 451527, 51298
Abstract:
The present invention relates to a method of manufacturing a polishing pad with embedded polymeric capsules useful for planarizing a substrate in a CMP process using a polishing composition. The method reduces non-uniformity of the polishing pad due to capsule floating, differential heating and capsule expansion by the use of novel capsule materials. The method also increases the efficiency of the manufacturing process by reducing the number of defective products and reducing waste.
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Alan H Saikin from Jackson, NJ, age ~69 Get Report